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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10903069 B1

PDFFull Text
Date of Patent:
Jan. 26, 2021

Filed:

Aug. 09, 2019

Method of fabricating layered structure

Applicant:

Jiangsu Advanced Memory Technology Co., Ltd., Huaian, CN;

Inventors:

Chung Hon Lam, Zhubei, TW;

Hao Ren Zhuang, Zhubei, TW;

Kuo-Feng Lo, Zhubei, TW;

Yen Yu Hsu, Zhubei, TW;

Assignee:

JIANGSU ADVANCED MEMORY TECHNOLOGY CO., LTD., Huaian, CN;

Attorney:

Maschoff Brennan

Primary Examiner:

Caridad Everhart

Assistant Examiner:

Ankush K Singal

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 21/3213 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
H01L 21/022 (2013.01); H01L 21/3212 (2013.01); H01L 21/32138 (2013.01); H01L 21/76816 (2013.01);
Abstract

A method of fabricating layered structure is disclosed. A basal layer is formed. A laminate is formed on the basal layer, and the laminate includes a device layer, a sacrificial layer and a protection layer stacked in sequence. The device layer, the sacrificial layer and the protection layer are etched to obtain a patterned laminate. A first dielectric layer covering a lateral surface of the patterned laminate is formed. Part of the first dielectric layer and part of the protection layer are removed by polishing. The protection layer of the patterned laminate is etched to expose the sacrificial layer. A through hole in the first dielectric layer is formed to expose the basal layer. The sacrificial layer of the patterned laminate is etched to form an opening in the first dielectric layer, and the opening exposes a top surface of the device layer.

Find Patent Forward Citations

Lam, Chung. (2021). Method of fabricating layered structure (U.S. Patent No. 10903069). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10903069

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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