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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10897818 B1

PDFFull Text
Date of Patent:
Jan. 19, 2021

Filed:

Jul. 07, 2015

Metal-clad laminate, method for producing same, metal foil with resin, and printed wiring board

Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Yuki Kitai, Osaka, JP;

Hiroaki Fujiwara, Nara, JP;

Assignee:

PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Timothy J Thompson

Assistant Examiner:

Rhadames Alonzo Miller

Int. Cl.
CPC ...
H05K 1/05 (2006.01); B32B 15/08 (2006.01); C08G 65/48 (2006.01); C08L 71/12 (2006.01); B32B 27/00 (2006.01); B32B 27/26 (2006.01); B32B 15/14 (2006.01); B32B 5/02 (2006.01); B32B 15/12 (2006.01); B32B 29/00 (2006.01); B32B 7/04 (2019.01); B32B 15/20 (2006.01); H05K 3/38 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/056 (2013.01); B32B 5/022 (2013.01); B32B 7/04 (2013.01); B32B 15/08 (2013.01); B32B 15/12 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); B32B 27/00 (2013.01); B32B 27/26 (2013.01); B32B 29/002 (2013.01); C08G 65/48 (2013.01); C08G 65/485 (2013.01); C08L 71/12 (2013.01); H05K 3/389 (2013.01); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2260/021 (2013.01); B32B 2260/023 (2013.01); B32B 2260/028 (2013.01); B32B 2260/046 (2013.01); B32B 2262/0269 (2013.01); B32B 2262/0276 (2013.01); B32B 2262/062 (2013.01); B32B 2262/101 (2013.01); B32B 2307/204 (2013.01); B32B 2307/306 (2013.01); B32B 2307/538 (2013.01); B32B 2307/748 (2013.01); B32B 2457/08 (2013.01); H05K 1/0326 (2013.01);
Abstract

A metal-clad laminate includes: a cured insulating layer including a polyphenylene ether compound; a metal layer joined with the insulating layer; and an intermediate layer interposed between the insulating layer and the metal layer, the intermediate layer including a silane compound. The metal layer has a junction surface that is joined with the insulating layer via the intermediate layer. The junction surface has a ten-point average roughness Rz ranging from 0.5 μm to 4 μm inclusive.

Find Patent Forward Citations

Kitai, Yuki. (2021). Metal-clad laminate, method for producing same, metal foil with resin, and printed wiring board (U.S. Patent No. 10897818). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10897818

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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