The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2021

Filed:

Nov. 15, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventor:

Aryan Afzalian, Chastre, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/332 (2006.01); H01L 29/66 (2006.01); H01L 29/08 (2006.01); H01L 29/205 (2006.01); H01L 29/04 (2006.01); H01L 29/06 (2006.01); H01L 29/165 (2006.01); H01L 29/267 (2006.01); H01L 29/423 (2006.01); B82Y 10/00 (2011.01); H01L 29/739 (2006.01); H01L 29/78 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66977 (2013.01); B82Y 10/00 (2013.01); H01L 29/045 (2013.01); H01L 29/0676 (2013.01); H01L 29/083 (2013.01); H01L 29/0834 (2013.01); H01L 29/0847 (2013.01); H01L 29/165 (2013.01); H01L 29/205 (2013.01); H01L 29/267 (2013.01); H01L 29/42376 (2013.01); H01L 29/66439 (2013.01); H01L 29/66522 (2013.01); H01L 29/66545 (2013.01); H01L 29/66666 (2013.01); H01L 29/66795 (2013.01); H01L 29/7391 (2013.01); H01L 29/068 (2013.01); H01L 29/785 (2013.01); H01L 29/78642 (2013.01);
Abstract

A method for fabricating a semiconductor device includes forming a channel region in a semiconductor substrate. The channel region is made of a first material. The method also includes forming source and drain regions in the semiconductor substrate. The method further includes forming a recess between the channel region and the drain region. The method further includes forming a tunnel barrier layer in the recess. The tunnel barrier layer is made of a second material, and a bandgap of the second material is greater than a bandgap of the first material. The method further includes forming a gate stack on the channel region.


Find Patent Forward Citations

Afzalian, Aryan. (2021). Method of fabricating semiconductor device (U.S. Patent No. 10896974). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10896974

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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