The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2021

Filed:

Sep. 27, 2018
Applicant:

Shibaura Mechatronics Corporation, Yokohama, JP;

Inventor:

Daisuke Ono, Yokohama, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); H01L 21/687 (2006.01); H01J 37/32 (2006.01); C23C 14/00 (2006.01); C23C 14/56 (2006.01); C23C 14/08 (2006.01); C23C 14/50 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68714 (2013.01); C23C 14/0042 (2013.01); C23C 14/0078 (2013.01); C23C 14/083 (2013.01); C23C 14/34 (2013.01); C23C 14/505 (2013.01); C23C 14/568 (2013.01); H01J 37/32449 (2013.01); H01J 37/32816 (2013.01); H01L 21/68764 (2013.01); H01L 21/68771 (2013.01);
Abstract

A film formation apparatus includes a film formation unit which includes a film formation room having an opening at one end, has a target formed of a film formation material in the film formation room, and deposits the film formation material of the target on a surface of a workpiece facing the opening by plasma produced by a sputter gas in the film formation room, and a carrier that carries the workpiece along a predetermined carrying path so that the workpiece repeatedly pass through a facing region which faces the opening of the film formation room and a non-facing region which does not face the opening of the film formation room. The carrier includes a low-pressure position where the workpiece is placed and which causes an interior of the film formation room to be lower than a plasma ignition lower limit pressure and to be equal to or higher than a plasma electric discharge maintaining lower limit pressure when passing through the facing region, and a high-pressure position where workpiece is not placed and which causes the interior of the film formation room to be equal to or higher than the plasma ignition lower limit pressure when passing through the facing region.


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