The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2021
Filed:
Aug. 11, 2017
Applicant:
Yale University, New Haven, CT (US);
Assignee:
Yale University, New Haven, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C30B 29/40 (2006.01); H01L 33/00 (2010.01); H01L 21/306 (2006.01); C30B 25/18 (2006.01); C23C 16/04 (2006.01); C23C 16/30 (2006.01); C23C 16/56 (2006.01); C30B 25/04 (2006.01); C30B 33/10 (2006.01); H01L 29/04 (2006.01); H01L 29/20 (2006.01); H01L 29/207 (2006.01); H01L 29/32 (2006.01); H01L 29/36 (2006.01); H01L 33/02 (2010.01); H01L 33/12 (2010.01); H01L 33/20 (2010.01); H01L 33/32 (2010.01);
U.S. Cl.
CPC ...
H01L 21/02694 (2013.01); C23C 16/042 (2013.01); C23C 16/303 (2013.01); C23C 16/56 (2013.01); C30B 25/04 (2013.01); C30B 25/18 (2013.01); C30B 25/186 (2013.01); C30B 29/406 (2013.01); C30B 33/10 (2013.01); H01L 21/0242 (2013.01); H01L 21/0243 (2013.01); H01L 21/0254 (2013.01); H01L 21/0257 (2013.01); H01L 21/0262 (2013.01); H01L 21/02433 (2013.01); H01L 21/02458 (2013.01); H01L 21/02576 (2013.01); H01L 21/02609 (2013.01); H01L 21/02639 (2013.01); H01L 21/02647 (2013.01); H01L 21/30612 (2013.01); H01L 21/30617 (2013.01); H01L 29/045 (2013.01); H01L 29/2003 (2013.01); H01L 29/207 (2013.01); H01L 29/32 (2013.01); H01L 29/36 (2013.01); H01L 33/007 (2013.01); H01L 33/025 (2013.01); H01L 33/12 (2013.01); H01L 33/20 (2013.01); H01L 33/325 (2013.01);
Abstract
Methods and structures for forming epitaxial layers of Ill-nitride materials on patterned foreign substrates with low stacking fault densities are described. Semipolar and nonpolar orientations of GaN that are essentially free from stacking faults may be grown from crystal-growth facets of a patterned substrate. Etching can be used to remove stacking faults if present. Crystal growth with an impurity can eliminate crystal growth from a facet that is responsible for stacking fault formation and permit substantially stacking-fault-free growth of the Ill-nitride material.