The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2021
Filed:
Feb. 28, 2018
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Fumiaki Ishikawa, Naka, JP;
Kazuhiko Yamasaki, Naka-gun, JP;
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 1/18 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0201 (2013.01); H05K 1/0306 (2013.01); H05K 1/056 (2013.01); H05K 1/18 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0266 (2013.01);
Abstract
This heat dissipation circuit board includes a metal substrate, an insulating layer provided on at least one of the surfaces of the metal substrate, and a circuit layer provided on the opposite surface to the metal substrate of the insulating layer. The insulating layer contains a resin that is selected from polyimide, polyamide-imide, and the mixture thereof, and ceramic particles having a specific surface area of 10 m/g or more. The ceramic particles form agglomerates, and the amount of the ceramic particles is in the range of 5 vol % or more and 60 vol % or less.