The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2021

Filed:

Jan. 11, 2017
Applicant:

Namics Corporation, Niigata, JP;

Inventor:

Tomoyuki Takahashi, Niigata, JP;

Assignee:

NAMICS CORPORATION, Niigata, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); C09D 5/24 (2006.01); H01L 23/00 (2006.01); C08K 3/08 (2006.01); C08K 5/09 (2006.01); C08K 5/17 (2006.01); C08K 13/02 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); C08K 3/08 (2013.01); C08K 5/09 (2013.01); C08K 5/17 (2013.01); C08K 13/02 (2013.01); H01B 1/22 (2013.01); C08K 2003/085 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29347 (2013.01);
Abstract

An object of the present invention is to provide: a resin composition in which the specific resistance after curing is low regardless of the type of a thermosetting resin, and furthermore, the specific resistance after curing does not significantly change depending on the content of a copper powder; and a conductive copper paste including the resin composition. There are provided a resin composition including (A) a copper powder having an oxygen content of 0.3% by mass or less, (B) a thermosetting resin, (C) a fatty acid, and (D) an amine or an amine compound, as well as a conductive copper paste containing the resin composition. The (A) component has an average particle size of preferably 1 to 10 μm.


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