The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2021
Filed:
Nov. 09, 2017
Applicant:
Stmicroelectronics, Inc., Calamba, PH;
Inventors:
Rennier Rodriguez, Meycauayan, PH;
Aiza Marie Agudon, Calamba, PH;
Maiden Grace Maming, Calamba, PH;
Assignee:
STMICROELECTRONICS, INC., Calamba, PH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/64 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49589 (2013.01); H01L 23/49548 (2013.01); H01L 23/647 (2013.01); H01L 23/49575 (2013.01); H01L 28/10 (2013.01); H01L 28/20 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01);
Abstract
The present disclosure is directed to a flat no-lead semiconductor package with a surfaced mounted structure. An end portion of the surface mounted structure includes a recessed member so that the surface mounted structure is coupled to leads of the flat no-lead semiconductor package through, among others, the sidewalls of the recessed members.
Rodriguez, Rennier. (2021). Flat no-lead package with surface mounted structure (U.S. Patent No. 10892212). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10892212
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile