The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2021
Filed:
Jul. 15, 2019
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Michael Tan, Singapore, SG;
Cheng P. Pour, Singapore, SG;
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/26 (2006.01); H01L 21/322 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 27/146 (2006.01); H01L 31/18 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
H01L 23/26 (2013.01); H01L 21/3221 (2013.01); H01L 21/3225 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/564 (2013.01); H01L 27/14698 (2013.01); H01L 31/186 (2013.01); H01L 51/5259 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15311 (2013.01); Y10T 428/28 (2015.01);
Abstract
Disclosed embodiments include external gettering provided by electronic packaging. An external gettering element for a semiconductor substrate, which may be incorporated as part of an electronic packaging for the structure, is disclosed. Semiconductor structures and stacked semiconductor structures including an external gettering element are also disclosed. An encapsulation mold compound providing external gettering is also disclosed. Methods of fabricating such devices are also disclosed.