The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2021
Filed:
Apr. 01, 2019
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 23/544 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/04 (2013.01); H01L 21/4803 (2013.01); H01L 23/544 (2013.01); H01L 2223/54406 (2013.01);
Abstract
A semiconductor package structure includes a substrate, a semiconductor sensor, a lid and an air-permeable film. The semiconductor sensor is disposed on the substrate. The lid covers the semiconductor sensor and defines a through hole. The air-permeable film covers the through hole of the lid and has a first surface. The first surface is hydrophilic.
Chen, Yu-Ming. (2021). Semiconductor package structure, product and method for manufacturing the same (U.S. Patent No. 10892199). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10892199
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile