The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2021

Filed:

Sep. 28, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Vivek Bharat Shah, Sunnyvale, CA (US);

Bhaskar Kumar, Santa Clara, CA (US);

Anup Kumar Singh, Santa Clara, CA (US);

Ganesh Balasubramanian, Sunnyvale, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 16/44 (2006.01); B08B 9/00 (2006.01); B08B 5/00 (2006.01); B08B 7/00 (2006.01); B08B 9/08 (2006.01); C23C 16/24 (2006.01); C23C 16/50 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32862 (2013.01); B08B 5/00 (2013.01); B08B 7/0035 (2013.01); B08B 9/00 (2013.01); B08B 9/08 (2013.01); C23C 16/24 (2013.01); C23C 16/4404 (2013.01); C23C 16/4405 (2013.01); C23C 16/4408 (2013.01); C23C 16/50 (2013.01); H01J 37/3288 (2013.01);
Abstract

Implementations of the present disclosure provide methods for treating a processing chamber. In one implementation, the method includes purging a 300 mm substrate processing chamber, without the presence of a substrate, by flowing a purging gas into the substrate processing chamber at a flow rate of about 0.14 sccm/mmto about 0.33 sccm/mmand a chamber pressure of about 1 Torr to about 30 Torr, with a throttle valve of a vacuum pump system of the substrate processing chamber in a fully opened position, wherein the purging gas is chemically reactive with deposition residue on exposed surfaces of the substrate processing chamber.


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