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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10890554 B1

PDFFull Text
Date of Patent:
Jan. 12, 2021

Filed:

Jun. 20, 2019

Sensors with a non-planar sensing structure

Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Lanxiang Wang, Singapore, SG;

Eng Huat Toh, Singapore, SG;

Shyue Seng Tan, Singapore, SG;

Ping Zheng, Singapore, SG;

Assignee:

GLOBALFOUNDRIES SINGAPORE PTE. LTD., Singapore, SG;

Attorney:

Thompson Hine LLP

Primary Examiner:

Robert G Bachner

Int. Cl.
CPC ...
H01L 27/148 (2006.01); G01N 27/414 (2006.01); H01L 29/423 (2006.01); H01L 21/84 (2006.01); H01L 27/12 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
G01N 27/414 (2013.01); H01L 21/845 (2013.01); H01L 27/1211 (2013.01); H01L 29/42364 (2013.01); H01L 29/785 (2013.01);
Abstract

Structures for a sensor and fabrication methods for a sensor. Features each having a top surface and a plurality of side surfaces are formed. A sensing layer is formed on the top surface and the side surfaces of each feature, and an interconnect structure having one or more interlayer dielectric layers is formed over the features. The one or more interlayer dielectric layers include a cavity arranged to expose the sensing layer, and the sensing layer is composed of a material that is sensitive to a property of an analyte solution provided in the cavity.

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