The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2021
Filed:
Sep. 24, 2019
Disco Corporation, Tokyo, JP;
Nobuyuki Kimura, Tokyo, JP;
Keiji Nomaru, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A thickness measuring apparatus for measuring a thickness of a wafer includes a light source emitting light having a transmission wavelength region to the wafer, a focusing unit applying the light emitted from the light source to the wafer held on a chuck table, an optical branching section branching the light reflected on the wafer held on the chuck table, a diffraction grating diffracting the reflected light branched by the optical branching section to obtain diffracted light of different wavelengths, an image sensor detecting an intensity of the diffracted light obtained by the diffraction grating to produce a spectral interference waveform, and a computing unit computing the spectral interference waveform produced by the image sensor to output thickness information.