The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2021

Filed:

Mar. 10, 2020
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Masashi Shimoyama, Tokyo, JP;

Takashi Kishi, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/00 (2006.01); H01L 21/67 (2006.01); C25D 5/02 (2006.01); B08B 7/00 (2006.01); C25D 7/12 (2006.01); C25D 17/06 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C25D 17/001 (2013.01); B08B 7/0057 (2013.01); C25D 5/022 (2013.01); C25D 7/123 (2013.01); C25D 17/00 (2013.01); C25D 17/06 (2013.01); H01L 21/02068 (2013.01); H01L 21/6723 (2013.01); H01L 21/67057 (2013.01); H01L 21/67115 (2013.01); C25D 17/004 (2013.01);
Abstract

The present invention improves the hydrophilicity of a substrate surface, and suppresses variation in the degree of hydrophilicity with each substrate. A plating apparatus is provided that performs a plating process on a substrate having a resist pattern. This plating apparatus includes a pretreatment bath that performs hydrophilic treatment by bringing a pretreatment liquid into contact with a surface to be plated of the substrate, and a plating bath that performs a plating process on a substrate that has undergone the hydrophilic treatment. The pretreatment bath includes a pretreatment liquid supplying device that supplies the pretreatment liquid into the pretreatment bath, and an ultraviolet light irradiation device that irradiates ultraviolet light onto the surface to be plated of the substrate.


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