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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10888941 B1

PDFFull Text
Date of Patent:
Jan. 12, 2021

Filed:

Oct. 24, 2018

Power semiconductor module

Applicant:

Hitachi Power Semiconductor Device, Ltd., Ibaraki, JP;

Inventors:

Daichi Kawamura, Tokyo, JP;

Toru Masuda, Tokyo, JP;

Junpei Kusukawa, Tokyo, JP;

Naoki Sakurai, Tokyo, JP;

Assignee:

HITACHI POWER SEMICONDUCTOR DEVICE, LTD., Ibaraki, JP;

Attorney:

Mattingly & Malur, PC

Primary Examiner:

Omar F Mojaddedi

Int. Cl.
CPC ...
H01L 23/60 (2006.01); H01L 23/24 (2006.01); H01L 23/053 (2006.01); H01L 23/373 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); B23K 1/20 (2006.01); B23K 35/36 (2006.01); H05K 1/03 (2006.01); H05K 3/38 (2006.01); H05K 3/34 (2006.01); H01L 23/36 (2006.01); B23K 35/02 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B23K 1/20 (2013.01); B23K 35/025 (2013.01); H01L 23/053 (2013.01); H01L 23/24 (2013.01); H01L 23/36 (2013.01); H01L 23/3735 (2013.01); H01L 23/49811 (2013.01); H01L 23/60 (2013.01); H01L 24/33 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H05K 3/34 (2013.01); B23K 35/02 (2013.01); B23K 35/3602 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48491 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/13055 (2013.01);
Abstract

When a distance between an end portion of a brazing material and a downward extended line of a side surface of an insulating substrate is taken as 'a', and a distance between an end portion of a solder resist on the side of a solder and the downward extended line of the side surface of the insulating substrate is taken as 'b', the positional relationship a<b is satisfied. The position of the end portion of the solder is regulated by the solder resist, and the position of the end portion of the brazing material on the side of the side surface of the insulating substrate is closer to the side of the side surface of the insulating substrate than to the position of the end portion of the solder on the side of the side surface of the insulating substrate.

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