The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

Oct. 17, 2017
Applicant:

Mitsubishi Electric Research Laboratories, Inc., Cambridge, MA (US);

Inventors:

Koon Hoo Teo, Lexington, MA (US);

Nadim Chowdhury, Cambridge, MA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/778 (2006.01); H01L 29/78 (2006.01); H01L 29/423 (2006.01); H01L 29/20 (2006.01); H01L 29/10 (2006.01); H01L 29/51 (2006.01); H03K 17/687 (2006.01); H01L 29/66 (2006.01); H01L 21/306 (2006.01); H01L 21/285 (2006.01); H01L 21/02 (2006.01); H01L 29/205 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7787 (2013.01); H01L 21/0254 (2013.01); H01L 21/28593 (2013.01); H01L 21/30612 (2013.01); H01L 21/30621 (2013.01); H01L 29/1037 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/423 (2013.01); H01L 29/42316 (2013.01); H01L 29/42356 (2013.01); H01L 29/42376 (2013.01); H01L 29/516 (2013.01); H01L 29/6684 (2013.01); H01L 29/66462 (2013.01); H01L 29/66484 (2013.01); H01L 29/66795 (2013.01); H01L 29/7783 (2013.01); H01L 29/7786 (2013.01); H01L 29/7831 (2013.01); H01L 29/7851 (2013.01); H01L 29/78391 (2014.09); H03K 17/687 (2013.01); H01L 21/0262 (2013.01); H01L 21/02631 (2013.01); H01L 29/0657 (2013.01);
Abstract

A high electron mobility transistor includes a set of electrodes, such as a source, a drain, a top gate, and a side gate, and includes a semiconductor structure having a fin extending between the source and the drain. The top gate is arranged on top of the fin, and the side gate is arranged on a sidewall of the fin at a distance from the top gate. The semiconductor structure includes a cap layer positioned beneath the top gate and a channel layer arranged beneath the cap layer for providing electrical conduction. The cap layer includes nitride-based semiconductor material to enable a heterojunction forming a carrier channel between the source and the drain.


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