The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

Nov. 07, 2017
Applicant:

Stmicroelectronics, Inc., Coppell, TX (US);

Inventor:

Qing Liu, Watervliet, NY (US);

Assignee:

STMICROELECTRONICS, INC., Coppell, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/82 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66818 (2013.01); H01L 21/823431 (2013.01); H01L 29/6653 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01); H01L 29/7834 (2013.01); H01L 29/7843 (2013.01);
Abstract

A dual width SOI FinFET is disclosed in which different portions of a strained fin have different widths. A method of fabrication of such a dual width FinFET entails laterally recessing the strained fin in the source and drain regions using a wet chemical etching process so as to maintain a high degree of strain in the fin while trimming the widths of fin portions in the source and drain regions to less than 5 nm. The resulting FinFET features a wide portion of the fin in the channel region underneath the gate, and a narrower portion of the fin in the source and drain regions. An advantage of the narrower fin is that it can be more easily doped during the growth of the epitaxial raised source and drain regions.


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