The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

Apr. 19, 2019
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventors:

Takashi Tsuji, Matsumoto, JP;

Akimasa Kinoshita, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/16 (2006.01); H01L 21/02 (2006.01); H01L 21/04 (2006.01); H01L 21/3213 (2006.01); H01L 29/78 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H01L 29/417 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1608 (2013.01); H01L 21/02378 (2013.01); H01L 21/02529 (2013.01); H01L 21/02634 (2013.01); H01L 21/049 (2013.01); H01L 21/32133 (2013.01); H01L 29/0661 (2013.01); H01L 29/0878 (2013.01); H01L 29/1095 (2013.01); H01L 29/41741 (2013.01); H01L 29/4236 (2013.01); H01L 29/66734 (2013.01); H01L 29/7813 (2013.01);
Abstract

A silicon carbide semiconductor device, including a semiconductor substrate having first and second epitaxial layers. The second epitaxial layer is formed on a first main surface of the semiconductor substrate, and includes first and second semiconductor regions, selectively provided in a surface layer of the second epitaxial layer respectively in the active region and the border region, and a third semiconductor region. The semiconductor device further includes a trench penetrating the first and third semiconductor regions to reach the first epitaxial layer, a gate electrode provided in the trench via a gate insulating film, a first electrode electrically connected to the first and third semiconductor regions, and a second electrode provided at a second main surface of the semiconductor substrate. The second semiconductor region is separate from the first semiconductor region. A portion of the third semiconductor region is exposed at the first main surface of the semiconductor substrate, between the first and second semiconductor regions.


Find Patent Forward Citations

Tsuji, Takashi. (2021). Silicon carbide semiconductor device (U.S. Patent No. 10886371). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10886371

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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