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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10886213 B1

PDFFull Text
Date of Patent:
Jan. 05, 2021

Filed:

Aug. 04, 2020

Semiconductor device

Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Teruhiro Kuwajima, Ibaraki, JP;

Yasutaka Nakashiba, Ibaraki, JP;

Akira Matsumoto, Ibaraki, JP;

Akio Ono, Ibaraki, JP;

Tetsuya Iida, Ibaraki, JP;

Assignee:

RENESAS ELECTRONICS CORPORATION, Tokyo, JP;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Yuriy Semenenko

Int. Cl.
CPC ...
H03L 7/06 (2006.01); H01L 23/522 (2006.01); H01L 49/02 (2006.01); H03L 7/099 (2006.01); H01L 29/93 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5223 (2013.01); H01L 23/5222 (2013.01); H01L 23/5227 (2013.01); H01L 27/0629 (2013.01); H01L 28/10 (2013.01); H01L 28/86 (2013.01); H01L 29/93 (2013.01); H03L 7/099 (2013.01);
Abstract

A semiconductor device has a coil and wirings under the coil. In addition, a distance between the upper face of the wirings and the bottom face of the coil is 7 μm or larger, and the wirings have a plurality of linear wiring parts each wiring width of which is 1 μm or smaller. In addition, the linear wiring parts do not configure a loop wiring, and the coil and the linear wiring parts are overlapped with each other in planar view.

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Kuwajima, Teruhiro. (2021). Semiconductor device (U.S. Patent No. 10886213). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10886213

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