The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2021
Filed:
Jun. 14, 2018
Disco Corporation, Tokyo, JP;
Hiroshi Morikazu, Tokyo, JP;
Tasuku Koyanagi, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A method of processing a wafer includes: preparing a support substrate that can transmit ultraviolet rays having a wavelength of 300 nm or shorter and can support the wafer thereon; integrating a face side of the wafer and the support substrate by sticking the face side of the wafer and the support substrate to each other with an UV-curable resin whose adhesive power can be lowered by ultraviolet rays applied thereto interposed therebetween, thereby integrally combining the wafer and the support substrate with each other; processing a reverse side of the wafer; destroying the UV-curable resin by applying a focused laser beam in an ultraviolet range having a wavelength of 300 nm or shorter from a support substrate side; and peeling off the support substrate from the face side of the wafer.