The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

May. 01, 2019
Applicant:

Beijing Naura Microelectronics Equipment Co., Ltd., Beijing, CN;

Inventors:

Zhimin Bai, Beijing, CN;

Qiang Li, Beijing, CN;

Bin Deng, Beijing, CN;

Yuchun Deng, Beijing, CN;

Hougong Wang, Beijing, CN;

Peijun Ding, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/324 (2006.01); H01L 21/67 (2006.01); H01L 21/477 (2006.01); H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/324 (2013.01); H01L 21/20 (2013.01); H01L 21/477 (2013.01); H01L 21/6719 (2013.01); H01L 21/67098 (2013.01); H01L 21/67103 (2013.01); H01L 21/67115 (2013.01); H01L 21/67167 (2013.01); H01L 21/67248 (2013.01);
Abstract

A method includes maintaining a pressure in the process chamber at a threshold before and after a wafer is transferred into the process chamber and during the annealing process of the wafer. Not only the temperature fluctuation caused by the turbulent flow of the gas during the annealing process of the wafer can be avoided, but also the time for the temperature in the chamber to recover and stabilize can be shortened, thereby improving the equipment productivity.


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