The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10885963 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 05, 2021

Filed:

Dec. 14, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Dmitri Nikonov, Beaverton, OR (US);

Ilya Karpov, Portland, OR (US);

Ian Young, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 11/22 (2006.01); H01L 27/1159 (2017.01); G06N 3/02 (2006.01); G11C 11/54 (2006.01);
U.S. Cl.
CPC ...
G11C 11/223 (2013.01); G06N 3/02 (2013.01); G11C 11/2259 (2013.01); G11C 11/2275 (2013.01); G11C 11/54 (2013.01); H01L 27/1159 (2013.01);
Abstract

An embodiment includes an apparatus comprising: a first layer and a second layer; a first gate including first gate portions and a second gate including second gate portions; wherein the first layer: (a) is monolithic, (b) is between the first gate portions and is also between the second gate portions, and (c) includes a semiconductor material; wherein the second layer: (a) is between the first layer and at least one of the first gate portions and is also between the first layer and at least one of the second gate portions, and (b) includes oxygen and at least one of hafnium, silicon, yttrium, zirconium, barium, titanium, lead, or combinations thereof; wherein (a) a first plane intersects the first gate portions and the first and second layers, and (b) a second plane intersects the second gate portions and the first and second layers. Other embodiments are described herein.


Find Patent Forward Citations

Loading…