The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2021
Filed:
Dec. 08, 2016
At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;
Jonathan Silvano de Sousa, Vienna, AT;
Bernhard Reitmaier, Moederbrugg, AT;
Michael Polic, Leoben, AT;
Gerhard Maringer, Knittelfeld, AT;
Abstract
A heat pipe () for cooling an electronic device, especially a component carrier (), that comprises a central section () with a cavity () filled with a heat transfer fluid (). In longitudinal direction () of the heat pipe () directly connected with the central section () are a first end section () on a first end of the central section and a second end section () on the opposite second end of the central section, wherein the first end section and the second end section each comprise a landing structure () with a surface length (SL, SL, SL) and a surface width (SW, SW, SW) and wherein each landing structure is thermoconductively coupled with the central section of the heat pipe. A component carrier comprising at least one heat pipe for cooling it, and a method for producing the component carrier are also provided.