The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

Dec. 22, 2016
Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Takuya Maekawa, Joso, JP;

Masakuni Takahashi, Anpachi-gun, JP;

Shun Sato, Anpachi-gun, JP;

Kenji Yumoto, Anpachi-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23B 27/14 (2006.01); C23C 14/06 (2006.01); C04B 35/5831 (2006.01); C04B 41/89 (2006.01); C04B 35/58 (2006.01); C04B 41/52 (2006.01); C04B 35/645 (2006.01); C04B 35/56 (2006.01); C23C 28/04 (2006.01); C23C 28/00 (2006.01); C04B 41/87 (2006.01); C04B 41/88 (2006.01); C23C 14/32 (2006.01);
U.S. Cl.
CPC ...
C23C 14/0641 (2013.01); B23B 27/14 (2013.01); C04B 35/5611 (2013.01); C04B 35/58014 (2013.01); C04B 35/58021 (2013.01); C04B 35/5831 (2013.01); C04B 35/645 (2013.01); C04B 41/52 (2013.01); C04B 41/87 (2013.01); C04B 41/88 (2013.01); C04B 41/89 (2013.01); C23C 14/325 (2013.01); C23C 28/044 (2013.01); C23C 28/42 (2013.01); B23B 2224/24 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/386 (2013.01); C04B 2235/3813 (2013.01); C04B 2235/3847 (2013.01); C04B 2235/3865 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/6581 (2013.01); C04B 2235/782 (2013.01); C04B 2235/785 (2013.01); C04B 2235/786 (2013.01);
Abstract

The present invention is directed to a surface-coated cubic boron nitride sintered material tool including a cBN substrate and a hard coating layer formed on a surface of the cBN substrate and having an alternate laminated structure of A layer and B layer. The cBN substrate (sintered material) includes: a Ti compound, WC, AlN, TiB, AlO, and cBN. The A layer has a composition of (TiAl)N (0.4≤x≤0.7 in terms of atomic ratio). The B layer has a composition of (CrAlM)N (0.03≤y≤0.4 and 0≤z≤0.05 in terms of atomic ratio). A plastic deformation work ratio of the B layer is 0.35 to 0.50.


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