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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10883006 B1

PDFFull Text
Date of Patent:
Jan. 05, 2021

Filed:

Feb. 07, 2017

Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold

Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Keiko Chiba, Utsunomiya, JP;

Toshiki Ito, Kawasaki, JP;

Timothy Brian Stachowiak, Austin, TX (US);

Niyaz Khusnatdinov, Round Rock, TX (US);

Weijun Liu, Cedar Park, TX (US);

Assignee:

CANON KABUSHIKI KAISHA, Tokyo, JP;

Attorney:

Venable LLP

Primary Examiner:

Robert S Walters, Jr

Int. Cl.
CPC ...
B05D 3/12 (2006.01); C09D 11/101 (2014.01); G03F 7/16 (2006.01); C09D 133/06 (2006.01); B05D 1/30 (2006.01); B05D 3/04 (2006.01); B29C 35/08 (2006.01); B29C 59/02 (2006.01); C09D 11/107 (2014.01); C09D 11/30 (2014.01); C09D 133/08 (2006.01); C09D 135/02 (2006.01); G03F 7/00 (2006.01); B29K 33/00 (2006.01); B29L 11/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
C09D 11/101 (2013.01); B05D 1/30 (2013.01); B05D 3/04 (2013.01); B05D 3/12 (2013.01); B29C 35/0805 (2013.01); B29C 59/026 (2013.01); C09D 11/107 (2013.01); C09D 11/30 (2013.01); C09D 133/06 (2013.01); C09D 133/08 (2013.01); C09D 135/02 (2013.01); G03F 7/0002 (2013.01); G03F 7/161 (2013.01); B29C 2035/0833 (2013.01); B29K 2033/08 (2013.01); B29L 2011/00 (2013.01); B29L 2031/34 (2013.01);
Abstract

A pattern is formed on a substrate with forming a layer of a curable composition (A1) containing a polymerizable compound (a1) on a surface of the substrate, then dispensing droplets of a curable composition (A2) containing a polymerizable compound (a2) dropwise discretely onto the curable composition (A1) layer, subsequently sandwiching a mixture layer of the curable composition (A1) and the curable composition (A2) between a mold and the substrate, then irradiating the mixture layer with light to cure the mixture layer, and releasing the mold from the mixture layer after the curing. The curable composition (A1) except a solvent has a viscosity at 25° C. of 40 mPa·s or more and less than 500 mPa·s. The curable composition (A2) except a solvent has a viscosity at 25° C. of 1 mPa·s or more and less than 40 mPa·s.

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