The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2020
Filed:
Jun. 02, 2016
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Russell S. Aoki, Tacoma, WA (US);
Jeffory L. Smalley, East Olympia, WA (US);
Jonathan W. Thibado, Beaverton, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/00 (2006.01); H05K 1/02 (2006.01); G06F 1/20 (2006.01); G06F 1/16 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); H01L 25/065 (2006.01); H05K 1/14 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); G06F 1/16 (2013.01); G06F 1/206 (2013.01); H01L 23/49833 (2013.01); H01L 24/17 (2013.01); H05K 1/0212 (2013.01); H05K 1/181 (2013.01); H05K 3/341 (2013.01); H05K 3/3494 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/15323 (2013.01); H05K 1/144 (2013.01); H05K 3/3436 (2013.01); H05K 3/368 (2013.01); H05K 2201/041 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10325 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/10734 (2013.01);
Abstract
An apparatus is provided which comprises: a processor die; a processor substrate having a region extended away from the processor die, wherein the processor die is mounted on the processor substrate, wherein the extended region has at least one signal interface which is connectable to a top-side connector; and an interposer coupled to the processor substrate and a motherboard.