The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2020
Filed:
Mar. 25, 2019
Applicant:
At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;
Inventors:
Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01); H05K 1/02 (2006.01); H01L 33/62 (2010.01); H05K 1/03 (2006.01); H01L 23/15 (2006.01); H01L 23/373 (2006.01); H01L 33/64 (2010.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); H05K 3/02 (2006.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H05K 1/0209 (2013.01); H01L 23/15 (2013.01); H01L 23/3735 (2013.01); H01L 33/62 (2013.01); H01L 33/647 (2013.01); H05K 1/0203 (2013.01); H05K 1/036 (2013.01); H05K 1/181 (2013.01); H05K 1/182 (2013.01); H05K 3/4655 (2013.01); H01L 23/3731 (2013.01); H01L 23/3732 (2013.01); H01L 33/60 (2013.01); H01L 33/641 (2013.01); H01L 33/642 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01); H05K 1/0306 (2013.01); H05K 3/022 (2013.01); H05K 3/4602 (2013.01); H05K 3/4605 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/0152 (2013.01);
Abstract
A manufacturing method of manufacturing a constituent for a component carrier, wherein the method comprises providing an electrically conductive structure, forming a highly thermally conductive and electrically insulating or semiconductive structure on the electrically conductive structure, subsequently, and attaching a thermally conductive and electrically insulating structure, having a lower thermal conductivity than the highly thermally conductive and electrically insulating or semiconductive structure, on an exposed surface of the highly thermally conductive and electrically insulating or semiconductive structure.