The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2020

Filed:

Jun. 28, 2019
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Jeffrey Chromczak, Toronto, CA;

Paul Rotker, San Jose, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 19/177 (2020.01); H03K 19/17724 (2020.01); H01L 23/00 (2006.01); H01L 27/02 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H03K 19/17724 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 27/0255 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/1431 (2013.01);
Abstract

An integrated circuit device is disclosed that includes an interposer and a programmable fabric die disposed on the interposer. The programmable fabric die includes multiple sectors that each have multiple rows of logic element blocks. Each row of logic element blocks includes multiple microbumps. Each logic element block has programmable fabric circuitry and an input/output interface electrically coupled to a respective microbump. The integrated circuit device also includes a device disposed on the interposer external to the programmable fabric die and electrically coupled to the microbumps via the interposer.


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