The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2020

Filed:

Sep. 25, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Chun-Yang Tsai, Hsinchu, TW;

Kuo-Ching Huang, Hsinchu, TW;

Tong-Chern Ong, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 29/788 (2006.01); H01L 27/24 (2006.01); G11C 11/16 (2006.01); G11C 13/00 (2006.01); H01L 45/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/2436 (2013.01); G11C 11/1659 (2013.01); G11C 11/1673 (2013.01); G11C 11/1675 (2013.01); G11C 13/003 (2013.01); G11C 13/004 (2013.01); G11C 13/0069 (2013.01); H01L 45/1253 (2013.01); G11C 2013/0042 (2013.01); G11C 2013/0071 (2013.01); G11C 2013/0073 (2013.01); G11C 2013/0088 (2013.01); G11C 2213/71 (2013.01); G11C 2213/78 (2013.01); G11C 2213/79 (2013.01); G11C 2213/82 (2013.01);
Abstract

The present disclosure, in some embodiments, relates to a method of forming an integrated chip. The method may include forming a control device within a substrate. A first plurality of interconnect layers are formed within a first inter-level dielectric (ILD) structure over the substrate. A first memory device and a second memory device are formed over the first ILD structure. A second plurality of interconnect layers are formed within a second ILD structure over the first ILD structure. The first plurality of interconnect layers and the second plurality of interconnect layers couple the first memory device and the second memory device to the control device.


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