The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2020
Filed:
Feb. 15, 2019
Applicant:
Western Digital Technologies, Inc., San Jose, CA (US);
Inventors:
Assignee:
Western Digital Technologies, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 21/469 (2006.01); H01L 23/522 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 23/5386 (2013.01);
Abstract
A semiconductor device is disclosed including a stack of semiconductor die. Openings are formed in the semiconductor die as they are added to the stack, which openings are aligned at different levels of the stack. The openings are filled with an electrically insulative compound to form a molded column through all semiconductor die in the stack. After all semiconductor die are added to the stack, a via may be drilled through the molded column to electrically interconnect each semiconductor die in the stack.