The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 22, 2020

Filed:

May. 22, 2017
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Kazuya Hirata, Tokyo, JP;

Yasuyoshi Yubira, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/0622 (2014.01); H01S 3/10 (2006.01); B23K 26/03 (2006.01); B23K 26/00 (2014.01); B23K 26/53 (2014.01); B23K 26/08 (2014.01); C30B 29/40 (2006.01); C30B 33/06 (2006.01); B23K 26/035 (2014.01); B23K 26/364 (2014.01); B23K 26/10 (2006.01); B23K 26/38 (2014.01); B23K 26/40 (2014.01); H01L 21/02 (2006.01); B23K 103/00 (2006.01); B23K 101/40 (2006.01); H01S 3/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0622 (2015.10); B23K 26/0006 (2013.01); B23K 26/032 (2013.01); B23K 26/035 (2015.10); B23K 26/0823 (2013.01); B23K 26/0853 (2013.01); B23K 26/10 (2013.01); B23K 26/364 (2015.10); B23K 26/38 (2013.01); B23K 26/40 (2013.01); B23K 26/53 (2015.10); C30B 29/406 (2013.01); C30B 33/06 (2013.01); H01L 21/02002 (2013.01); H01S 3/1003 (2013.01); B23K 2101/40 (2018.08); B23K 2103/50 (2018.08); H01S 3/0085 (2013.01);
Abstract

A laser processing apparatus for producing a GaN wafer from a GaN ingot includes a laser beam irradiating unit configured to apply a laser beam having a wavelength capable of passing through the GaN ingot held by a chuck table. The laser beam irradiating unit includes a laser oscillator configured to oscillate the laser beam. The laser oscillator includes a seeder configured to oscillate a high-frequency pulsed laser, a thinning-out unit configured to thin out high-frequency pulses oscillated by the seeder at a predetermined repetition frequency, and generate one burst pulse with a plurality of high-frequency pulses as sub-pulses, and an amplifier configured to amplify the generated burst pulse.


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