The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2020

Filed:

Oct. 15, 2018
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Xia Li, San Diego, CA (US);

Wei-Chuan Chen, San Diego, CA (US);

Seung Hyuk Kang, San Diego, CA (US);

Assignee:

Qualcomm Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 43/12 (2006.01); H01L 43/10 (2006.01); H01L 27/22 (2006.01); H01L 43/02 (2006.01); H01L 43/08 (2006.01);
U.S. Cl.
CPC ...
H01L 43/12 (2013.01); H01L 27/222 (2013.01); H01L 43/02 (2013.01); H01L 43/08 (2013.01); H01L 43/10 (2013.01);
Abstract

Certain aspects of the present disclosure provide techniques for fabricating an integrated circuit with a magnetic tunnel junction (MTJ) without a patterning process for the MTJ. An example method generally includes depositing a first diffusion barrier layer above an oxide layer having a conductive pillar therein, forming a first trench in the first diffusion barrier layer above the conductive pillar, depositing a first electrode in the first trench such that the first electrode is coupled to the conductive pillar, removing the oxide layer and the first diffusion barrier layer to expose the conductive pillar and the first electrode, and depositing an MTJ above the first electrode according to a shape of the first electrode.


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