The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2020
Filed:
Aug. 10, 2015
Applicant:
Amkor Technology, Inc., Tempe, AZ (US);
Inventors:
Won Chul Do, Bucheon-si, KR;
Jin Hee Park, Seoul, KR;
Assignee:
Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H05K 3/34 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 21/563 (2013.01); H01L 23/49827 (2013.01); H05K 3/3436 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3511 (2013.01); H05K 2201/09136 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/10977 (2013.01); H05K 2203/047 (2013.01); H05K 2203/1476 (2013.01); Y02P 70/50 (2015.11); Y10T 29/4913 (2015.01);
Abstract
A method for manufacturing a semiconductor device, for example formed utilizing component stacking. As non-limiting examples, various aspects of this disclosure provide a method for reducing warpage and/or stress in stacked semiconductor devices.