The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2020

Filed:

Feb. 07, 2019
Applicant:

Cree, Inc., Durham, NC (US);

Inventors:

Alexander Suvorov, Durham, NC (US);

Robert Leonard, Raleigh, NC (US);

Edward Robert Van Brunt, Raleigh, NC (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 21/04 (2006.01); H01L 29/06 (2006.01); H01L 21/265 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0415 (2013.01); H01L 21/046 (2013.01); H01L 21/26506 (2013.01); H01L 29/0657 (2013.01);
Abstract

The wafer fabrication technique uses an ion implantation process on the back side of the wafer to control the shape of the wafer. At least one first dopant is implanted into a front side of a wafer to dope the wafer. At least one second dopant is implanted into a back side of the wafer in a dopant profile to create a back side structure, where the back side structure controls a shape of the wafer. A blank wafer is provided that has an undoped front side and a form shaping back side structure on the back side. A doped wafer is provided that has a dopant implanted on the front side and a form shaping back side structure on the back side that least partially offsets the strain in the wafer induced by the front side dopant.


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