The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2020
Filed:
Jun. 26, 2019
Applicant:
Tong Hsing Electronic Industries, Ltd., Taipei, TW;
Inventor:
Chia-Shuai Chang, Taipei, TW;
Assignee:
TONG HSING ELECTRONIC INDUSTRIES, LTD., Taipei, TW;
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G06K 9/20 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
G06K 9/00053 (2013.01); G06K 9/209 (2013.01); H01L 27/14618 (2013.01); H01L 27/14636 (2013.01); H01L 27/14678 (2013.01); H01L 27/14683 (2013.01);
Abstract
A method for making a fingerprint sensor package module includes the steps of: providing a substrate, disposing a fingerprint sensor chip over a mounting region of the substrate, forming a masking layer on a sensing region of the fingerprint sensor chip, electrically connecting the substrate to the fingerprint sensor chip, molding an encapsulation structure, and removing the masking layer to expose the sensing region of the fingerprint sensor chip.
Chang, Chia-Shuai. (2020). Process for making a fingerprint sensor package module and the fingerprint sensor package module made thereby (U.S. Patent No. 10867158). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10867158
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile