The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2020

Filed:

Jan. 25, 2016
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Yan Zhao, Palo Alto, CA (US);

Hokeun Kim, Palo Alto, CA (US);

Lihua Zhao, Palo Alto, CA (US);

Jun Zeng, Palo Alto, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/00 (2006.01); G05B 19/4099 (2006.01); B33Y 50/00 (2015.01); B29C 64/153 (2017.01); B29C 64/386 (2017.01); B22F 3/105 (2006.01); H04N 1/60 (2006.01);
U.S. Cl.
CPC ...
G05B 19/4099 (2013.01); B29C 64/153 (2017.08); B29C 64/386 (2017.08); B33Y 50/00 (2014.12); B22F 3/1055 (2013.01); B22F 2003/1057 (2013.01); G05B 2219/49007 (2013.01); H04N 1/6011 (2013.01);
Abstract

A three-dimensional (3D) object printing process-level simulator including, in an example, a layer module for modeling a plurality of layers of a simulated 3D object to be built and a printing device controller to receive a number of simulated values from the layer module to simulate a 3D object printing process and adjust the 3D object printing process based on physical characteristics of a printing device associated with the printing device controller. A cyber-physical three-dimensional (3D) object printing simulator including, in an example, a printing device including a processor to send instructions describing how a simulated 3D object is to be printed and a layers module to simulate heat transfer from a plurality of layers in the 3D object to be printed based at least a density of the plurality of layers.


Find Patent Forward Citations

Loading…