The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2020
Filed:
Jan. 05, 2018
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Pooya Tadayon, Portland, OR (US);
Justin Huttula, Hillsboro, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/20 (2006.01); G01R 1/067 (2006.01); H05K 1/11 (2006.01); H05K 3/18 (2006.01); H05K 1/09 (2006.01); G01R 1/073 (2006.01); G01R 3/00 (2006.01);
U.S. Cl.
CPC ...
G01R 1/06755 (2013.01); G01R 1/06722 (2013.01); G01R 1/06727 (2013.01); G01R 1/07314 (2013.01); G01R 3/00 (2013.01); H05K 1/09 (2013.01); H05K 1/118 (2013.01); H05K 3/188 (2013.01); G01R 1/06772 (2013.01); H01L 2224/45144 (2013.01); H01L 2924/00 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12042 (2013.01); H05K 2203/0723 (2013.01);
Abstract
An interconnect structure is provided which includes: a member having a first end coupled to a test card, and a second end opposite the first end; and a contact tip at the second end of the member, the contact tip to removably attach to another interconnect structure of a device under test, where a modulus of elasticity of the member varies along a length of the member.