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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10864557 B1

PDFFull Text
Date of Patent:
Dec. 15, 2020

Filed:

Mar. 21, 2017

System for cleaning wafer in cmp process of semiconductor manufacturing fabrication

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chia-Ying Tien, Taipei, TW;

Chia-Lin Hsueh, Zhubei, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;

Attorney:

McClure, Qualey & Rodack, LLP

Primary Examiner:

Sylvia MacArthur

Int. Cl.
CPC ...
B08B 3/12 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); B24B 37/20 (2012.01); B24B 37/34 (2012.01); B08B 1/00 (2006.01); B08B 1/04 (2006.01);
U.S. Cl.
CPC ...
B08B 3/12 (2013.01); B08B 1/00 (2013.01); B08B 1/007 (2013.01); B08B 1/04 (2013.01); B24B 37/20 (2013.01); B24B 37/34 (2013.01); H01L 21/02065 (2013.01); H01L 21/02074 (2013.01); H01L 21/67028 (2013.01); H01L 21/67046 (2013.01);
Abstract

A system for performing a Chemical Mechanical Polishing (CMP) process is provided. The system includes a CMP module configured to polish a semiconductor wafer. The system further includes a cleaning brush assembly configured to clean the semiconductor wafer. The cleaning brush includes a rotation shaft and a brush member surrounding a segment of the rotation shaft. The system also includes an agitation transducer arranged to be distant from the brush member and configured to produce an agitated cleaning liquid to clean the cleaning brush assembly.

Find Patent Forward Citations

Tien, Chia-Ying. (2020). System for cleaning wafer in cmp process of semiconductor manufacturing fabrication (U.S. Patent No. 10864557). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10864557

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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