The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

Aug. 23, 2018
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi, JP;

Inventors:

Masahiro Katayama, Tochigi, JP;

Yasutaka Nakazawa, Tochigi, JP;

Masatoshi Yokoyama, Tochigi, JP;

Masahiko Hayakawa, Tochigi, JP;

Kenichi Okazaki, Tochigi, JP;

Shunsuke Koshioka, Tochigi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/786 (2006.01); G09G 3/20 (2006.01); G09G 3/36 (2006.01); G09G 5/00 (2006.01); H01L 27/12 (2006.01); G06F 3/041 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7869 (2013.01); G06F 3/041 (2013.01); G09G 3/20 (2013.01); G09G 3/3674 (2013.01); G09G 3/3677 (2013.01); G09G 3/3685 (2013.01); G09G 3/3688 (2013.01); G09G 5/003 (2013.01); H01L 27/1225 (2013.01); H01L 27/1248 (2013.01); H01L 29/78606 (2013.01); G09G 2300/0404 (2013.01); G09G 2300/0426 (2013.01); G09G 2310/0267 (2013.01); G09G 2310/0275 (2013.01);
Abstract

A semiconductor device including a transistor and a wiring electrically connected to the transistor each of which has excellent electrical characteristics because of specific structures thereover is provided. A first conductive film, a first insulating film over the first conductive film, a second conductive film over the first insulating film, a second insulating film over the second conductive film, a third conductive film electrically connected to the first conductive film through an opening provided in the first insulating film and the second insulating film, and a third insulating film over the third conductive film are provided. The third conductive film includes indium, tin, and oxygen, and the third insulating film includes silicon and nitrogen and the number of ammonia molecules released from the third insulating film is less than or equal to 1×10molecules/cmby thermal desorption spectroscopy.


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