The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

Jul. 05, 2019
Applicant:

Asm Technology Singapore Pte Ltd, Singapore, SG;

Inventors:

Jiangwen Deng, Hong Kong, HK;

Chung Sheung Yung, Hong Kong, HK;

Wui Fung Sze, Hong Kong, HK;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 13/08 (2006.01); H01L 23/00 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); H01L 22/20 (2013.01); H01L 24/83 (2013.01); H05K 13/089 (2018.08); H05K 13/0813 (2018.08); H05K 13/0815 (2018.08); H01L 2224/75705 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/83132 (2013.01);
Abstract

After a die is picked up with a bond head, a first optical system views and determines a position and orientation of the die relative to the bond head. Separately, a second optical system views and determines a position and orientation of the bonding location when the second optical system has its focal plane configured at a first distance from the second optical system. After the bond head is moved adjacent to the second optical system, the second optical system views and determines a position and orientation of the bond head when the second optical system has its focal plane configured at a second distance from the second optical system. The position and orientation of the die may then be adjusted to correct a relative offset between the die and the bonding location prior to depositing the die onto the bonding location.


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