The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

Apr. 13, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jongwoo Sun, Hwaseong-si, KR;

Hakyoung Kim, Bucheon-si, KR;

Yun-Kwang Jeon, Seoul, KR;

Wonyoung Jee, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67253 (2013.01); H01J 37/32963 (2013.01); H01L 21/6719 (2013.01); H01L 21/67069 (2013.01); H01L 21/68764 (2013.01); H01L 21/68785 (2013.01); H01J 37/3211 (2013.01); H01J 37/3244 (2013.01); H01J 2237/334 (2013.01);
Abstract

Disclosed are a substrate inspection apparatus and a substrate processing system. The substrate inspection apparatus includes a sensor module and a jig associated with the sensor module to transfer the sensor module. The sensor module may include a housing having a first surface and a second surface facing each other and including an insertion hole connecting the first and second surfaces to each other, a sensor inserted into the insertion hole to measure a state of the substrate, and a tilting member on the housing to adjust tilt of the housing.


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