The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2020
Filed:
Jan. 15, 2019
Applicant:
Asm Technology Singapore Pte Ltd, Singapore, SG;
Inventors:
Pak Lun Cheng, Hong Kong, HK;
Jun Qi, Hong Kong, HK;
Yong Wang, Hong Kong, HK;
Chao Liu, Chengdu, CN;
Pingliang Tu, Hong Kong, HK;
Ka Fai Fung, Hong Kong, HK;
Assignee:
ASM TECHNOLOGY SINGAPORE PTE LTD, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 21/50 (2013.01); H01L 21/02002 (2013.01); H01L 21/67126 (2013.01); H01L 24/95 (2013.01); H01L 2021/60097 (2013.01); H01L 2224/8385 (2013.01);
Abstract
A semiconductor die is bonded using epoxy onto a substrate supported on a heating platform. After preheating the substrate with the heating platform to a temperature of between 25° C. and 60° C., an epoxy dispenser deposits an epoxy dot onto the substrate before the semiconductor die is placed onto the epoxy dot with a pick head to thereby bond the semiconductor die onto the substrate.