The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

Dec. 06, 2018
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Oliver Nagler, Munich, DE;

Sebastian Bernrieder, Regensburg, DE;

Marianne Unterreitmeier, Woerth, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 29/04 (2006.01); G01R 31/28 (2006.01); G01N 29/14 (2006.01);
U.S. Cl.
CPC ...
G01N 29/14 (2013.01); G01N 29/045 (2013.01); G01R 31/2831 (2013.01); G01N 2291/2697 (2013.01);
Abstract

A system for examining semiconductor substrates may comprise an indenter configured to exercise a force onto the semiconductor substrate such that a crack in the semiconductor substrate occurs, a piezoelectric acoustic emission sensor configured to detect an acoustic signal emitted by the crack, and attaching means configured to fasten the indenter to a first surface of the piezoelectric acoustic emission sensor. The indenter and the attaching means are configured to transmit the acoustic signal to the piezoelectric acoustic emission sensor. The resonance frequencies of the indenter and the piezoelectric acoustic emission sensor are attuned to one another.


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