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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10858514 B1

PDFFull Text
Date of Patent:
Dec. 08, 2020

Filed:

Sep. 18, 2015

Resin composition and pre-preg and laminate using the composition

Applicant:

Shengyi Technology Co., Ltd., Guangdong, CN;

Inventors:

Xianping Zeng, Guangdong, CN;

Guangbing Chen, Guangdong, CN;

Chiji Guan, Guangdong, CN;

Wenhua Yang, Guangdong, CN;

Assignee:

Shengyi Technology Co., Ltd., Guangdong, CN;

Attorneys:

Norton Rose Fulbright US LLP

James R. Crawford

Primary Examiner:

Callie E Shosho

Assistant Examiner:

Krupa Shukla

Int. Cl.
CPC ...
C08L 71/12 (2006.01); B32B 15/085 (2006.01); B32B 15/20 (2006.01); C08L 47/00 (2006.01); B32B 15/14 (2006.01); C08F 279/02 (2006.01); C08L 51/08 (2006.01); B32B 5/26 (2006.01); C08F 290/06 (2006.01); C08L 9/06 (2006.01); B32B 15/18 (2006.01); B32B 7/04 (2019.01); B32B 15/08 (2006.01); B32B 27/08 (2006.01); C08J 5/24 (2006.01); C08L 25/10 (2006.01);
U.S. Cl.
CPC ...
C08L 71/126 (2013.01); B32B 5/26 (2013.01); B32B 7/04 (2013.01); B32B 15/08 (2013.01); B32B 15/085 (2013.01); B32B 15/14 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); C08F 279/02 (2013.01); C08F 290/062 (2013.01); C08J 5/24 (2013.01); C08L 9/06 (2013.01); C08L 25/10 (2013.01); C08L 47/00 (2013.01); C08L 51/08 (2013.01); C08L 71/12 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2307/204 (2013.01); B32B 2307/306 (2013.01); B32B 2307/4026 (2013.01); B32B 2307/732 (2013.01); B32B 2457/08 (2013.01); C08J 2309/06 (2013.01); C08J 2325/10 (2013.01); C08J 2347/00 (2013.01); C08J 2371/02 (2013.01); C08J 2371/12 (2013.01); C08J 2409/00 (2013.01); C08J 2409/06 (2013.01); C08J 2425/10 (2013.01); C08J 2447/00 (2013.01); C08J 2471/02 (2013.01); C08L 2201/02 (2013.01);
Abstract

Copper clad laminates and a resin composition and a pre-preg and a laminate using the composition. The resin composition contains: (A) a prepolymer of vinyl thermosetting polyphenylene ether and a bifunctional maleimide or a multifunctional maleimide; and, (B) a polyolefin resin. Employing the prepolymer of vinyl thermosetting polyphenylene ether and the bifunctional maleimide or the multifunctional maleimide, solves the problem of incompatibility of the bifunctional maleimide or the multifunctional maleimide with the vinyl thermosetting polyphenylene ether and the polyolefin resin. An aqueous glue solution so mixed is uniform and consistent, the prepreg has a uniform expression, and a substrate resin area is free of a phase-separation problem.

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