The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2020
Filed:
Nov. 15, 2019
Ibiden Co., Ltd., Ogaki, JP;
Ikuya Terauchi, Ogaki, JP;
IBIDEN CO., LTD., Ogaki, JP;
Abstract
A printed wiring board includes a conductor layer including first and second pads, a coating layer covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, and metal bumps including a first bump on the first pad and a second bump on the second pad such that the first and second bumps protrude from the coating layer. The first and second openings are formed such that diameter of the second pad is smaller than diameter of the first pad. The first and second bumps are formed such that height of protruding portion of the first bump from the surface of the coating layer is substantially equal to height of protruding portion of the second bump from the surface of the coating layer and that the second bump covers an area of the coating layer on the surface surrounding the second opening.