The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2020
Filed:
Jul. 07, 2017
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Jung-Chan Yang, Taoyuan County, TW;
Ting-Wei Chiang, New Taipei, TW;
Cheng-I Huang, Hsinchu, TW;
Hui-Zhong Zhuang, Kaohsiung, TW;
Chi-Yu Lu, New Taipei, TW;
Stefan Rusu, Sunnyvale, CA (US);
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
An integrated circuit structure includes a set of rails, a first and second set of conductive structures and a first set of vias. The set of rails extends in a first direction and is located at a first level. Each rail of the set of rails is separated from one another in a second direction. The first set of conductive structures extends in the second direction, overlaps the set of rails and is located at a second level. The first set of vias is between the set of rails and the first set of conductive structures. Each of the first set of vias is located where each of the first set of conductive structures overlaps each of the set of rails. The first set of vias couple the first set of conductive structures to the set of rails. The second set of conductive structures is between the set of rails.