The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2020

Filed:

Jul. 26, 2018
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Satoshi Takagi, Nirasaki, JP;

Hiroyuki Hayashi, Nirasaki, JP;

Hsiulin Tsai, Nirasaki, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/52 (2006.01); C23C 16/40 (2006.01); C23C 16/455 (2006.01); C23C 16/04 (2006.01); C23C 16/02 (2006.01); C23C 16/24 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02645 (2013.01); C23C 16/0272 (2013.01); C23C 16/045 (2013.01); C23C 16/24 (2013.01); C23C 16/402 (2013.01); C23C 16/45544 (2013.01); C23C 16/45546 (2013.01); C23C 16/45553 (2013.01); C23C 16/52 (2013.01); H01L 21/0228 (2013.01); H01L 21/0243 (2013.01); H01L 21/0245 (2013.01); H01L 21/0262 (2013.01); H01L 21/02164 (2013.01); H01L 21/02211 (2013.01); H01L 21/02381 (2013.01); H01L 21/02499 (2013.01); H01L 21/02532 (2013.01); H01L 21/02488 (2013.01); H01L 21/02507 (2013.01); H01L 21/02592 (2013.01);
Abstract

A method of forming a silicon film in a recess formed in a target substrate includes: preparing a target substrate having a recess in which a plurality of different bases is exposed; forming an atomic layer seed on at least an inner surface of the recess by sequentially supplying a raw material gas adapted to the plurality of different bases and a reaction gas reacting with the raw material gas to the target substrate one or more times while heating the target substrate to a first temperature; and forming a silicon film on a surface of the atomic layer seed so as to fill the recess by supplying a first silicon raw material gas to the target substrate while heating the target substrate to a second temperature.


Find Patent Forward Citations

Loading…