The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2020
Filed:
Jul. 10, 2017
Applicant:
Sierra Circuits, Inc., Sunnyvale, CA (US);
Inventors:
Kenneth S. Bahl, Saratoga, CA (US);
Konstantine Karavakis, Pleasanton, CA (US);
Assignee:
CATLAM, LLC, Sunnyvale, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/00 (2006.01); H05K 3/06 (2006.01); C08K 3/34 (2006.01); H05K 3/10 (2006.01); C08K 3/36 (2006.01); H05K 3/42 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/022 (2013.01); C08K 3/34 (2013.01); C08K 3/346 (2013.01); C08K 3/36 (2013.01); H05K 3/0047 (2013.01); H05K 3/061 (2013.01); H05K 3/185 (2013.01); H05K 3/422 (2013.01); H05K 3/426 (2013.01); C08K 2201/005 (2013.01); H05K 3/002 (2013.01); H05K 3/0017 (2013.01); H05K 3/0026 (2013.01); H05K 3/0041 (2013.01); H05K 3/0044 (2013.01); H05K 3/108 (2013.01); H05K 3/427 (2013.01); H05K 2201/0236 (2013.01); H05K 2201/0376 (2013.01); H05K 2203/025 (2013.01); H05K 2203/107 (2013.01);
Abstract
A process for making a circuit board from a catalytic laminate having a resin rich surface with catalytic particles dispersed below a surface exclusion depth includes drilling holes, etching the surface to expose the catalytic particles, electroless plating the unmasked areas, applying a mask to the etched surface, electroplating the exposed areas using the electroless plating to form a continuous conductor, then stripping the mask and etching away the electroless copper deposition.