The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2020
Filed:
Dec. 30, 2019
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01Q 1/22 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01Q 1/02 (2006.01); H01Q 1/24 (2006.01); H01Q 21/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/3672 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01Q 1/02 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/243 (2013.01); H01Q 21/065 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01);
Abstract
A semiconductor package device includes a substrate having an upper surface; an antenna disposed on the upper surface of the substrate; a conductor disposed on the upper surface of the substrate and surrounding the antenna; and a package body covering the conductor and the upper surface of the substrate.