The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2020
Filed:
Jan. 01, 2019
Chung-che Tsai, Taipei, TW;
Chung-Che Tsai, Taipei, TW;
Other;
Abstract
A semiconductor package includes a substrate. At least a high-frequency chip and a circuit component susceptible to high-frequency interference are disposed on a top surface of the substrate. A first ground ring is disposed on the substrate surrounding the high-frequency chip. A first metal-post reinforced glue wall is disposed on the first ground ring surrounding the high-frequency chip. A second ground ring is disposed on the top of the substrate surrounding the circuit component. A second metal-post reinforced glue wall is disposed on the second ground ring surrounding the circuit component. A molding compound covers at least the high-frequency chip and the circuit component. A conductive layer is disposed on the molding compound and is coupled to the first metal-post reinforced glue wall and/or the second metal-post reinforced glue wall.